Microelectronic Packaging Mechanical Design Engineer

Overview: : You will work as part of a cross-functional team that is responsible for the design and development of cutting-edge AESA antenna hardware, that are fielded on a multitude of airborne, marine, ground-based, and space military platforms.
You'll support multiple projects spanning the product lifecycle, from R&D to full-rate production.
As an integral part of the Engineering and Sciences team, you will be responsible for the design and development of cutting-edge AESA antenna hardware.
: Roles and Responsibilities include:: - Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies - Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing.
- Organizing and prioritizing tasks in order to accomplish project milestones within schedule and budgetary constraints.
Basic Qualifications:: - Bachelor’s degree with 2 years of experience, a Master’s degree with 0 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, or closely related technical fields.
- U.
S Citizenship - The ability to obtain/maintain an active DoD Secret Clearance - Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate/PWB layout: - Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs: - Proficient with AutoCAD - Familiarity with NX or other 3D modeling software Preferred Qualifications:: - Active DoD Secret Clearance or higher - Proficiency with ASME Y14.
5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.
100 engineering drawing practices - Familiarity with thermal and structural analysis considerations, methodologies, and software tools - Experience with hands-on assembly and testing of prototype electronic hardware - Experience in a technical role on a cross-functional product development team AS&T is an EOE - M/F/D/V AS&T Offers a first class benefits package, competitive salary and bonus incentives.